GlobalFoundries rallies after US$2bn TSMC deal

An interposer is a slice of silicon placed under a chip and inside its package, holding the microscopic wiring that carries signals and power. As AI chips grow larger and packages combine several chips, GlobalFoundries will make them for TSMC under a five-year, $2 billion deal at its plant in upstate New York, with volume production starting in the first half of 2028.

Summary written with AI by HowTechMoves, based on reporting by Taipei Times.